Lub tshuab nqus tsev evaporation txheej yog siv cov cua kub los yog hluav taws xob hluav taws xob thiab laser foob pob hluav taws kom sov cov khoom kom evaporated mus rau qhov kub thiab txias hauv ib puag ncig nrog lub tshuab nqus tsev tsis tsawg dua 10-2Pa, kom lub thermal vibration zog ntawm molecules los yog atoms nyob rau hauv cov ntaub ntawv tshaj qhov saum npoo Lub zog khi ua rau ib tug loj tus naj npawb ntawm molecules los yog atoms mus evaporate los yog sublimate, thiab ncaj qha tso rau ntawm lub substrate los ua ib tug nyias zaj duab xis.
Txoj kev siv ntau tshaj plaws rau lub tshuab nqus tsev evaporation txheej yog cov cua kub tsis kam, uas muaj qhov zoo ntawm cov qauv yooj yim ntawm cov cua sov, tus nqi qis thiab kev ua haujlwm yooj yim. Qhov tsis zoo yog tias nws tsis haum rau cov hlau refractory thiab kub resistant dielectric cov ntaub ntawv.
Ion sputtering txheej siv lub zog ceev ceev ntawm cov ions zoo uas tsim los ntawm cov pa tawm mus rau lub hom phiaj raws li cathode nyob rau hauv qhov kev txiav txim ntawm hluav taws xob teb, ua rau cov atoms los yog molecules nyob rau hauv lub hom phiaj kom dim thiab precipitate rau saum npoo ntawm plated workpiece. los tsim cov yeeb yaj kiab uas xav tau. .
Sputtering tshuab yog txawv ntawm lub tshuab nqus tsev evaporation technology. "Sputtering" yog hais txog qhov tshwm sim uas cov khoom siv foob pob tawg rau saum npoo (lub hom phiaj), ua rau cov khoom atoms lossis cov molecules raug tshem tawm ntawm qhov chaw. Feem ntau ntawm cov ejected hais yog nyob rau hauv lub xeev atomic, feem ntau hu ua sputter atoms. Cov khoom siv hluav taws xob uas siv los tua lub hom phiaj tuaj yeem yog cov khoom siv hluav taws xob, ions lossis cov khoom nruab nrab. Vim tias ions yooj yim rau kev nrawm kom tau txais lub zog kinetic xav tau nyob rau hauv qhov hluav taws xob, ions feem ntau yog siv los ua foob pob tawg. Sputtered ions tag nrho yog los ntawm cov pa tawm.
Txawv sputtering technologies siv ntau txoj kev tso tawm. DC diode sputtering siv DC tawm; tripole sputtering siv tawm kev txhawb nqa los ntawm kub cathode; xov tooj cua zaus sputtering siv xov tooj cua zaus tawm; magnetron sputtering siv paug tswj los ntawm lub nplhaib magnetic teb.
Sputtering txheej muaj ntau yam zoo dua lub tshuab nqus tsev evaporation txheej. Piv txwv li, txhua yam khoom tuaj yeem raug sputtered, tshwj xeeb tshaj yog cov ntsiab lus thiab cov tebchaw uas muaj cov ntsiab lus melting siab thiab qis vapor siab. Lub adhesion ntawm sputtered zaj duab xis thiab substrate yog zoo; zaj duab xis ceev yog siab; cov yeeb yaj kiab tuab tuaj yeem tswj tau thiab qhov rov ua tau zoo, thiab lwm yam. Qhov tsis zoo yog tias cov khoom siv yog qhov nyuaj thiab yuav tsum muaj cov khoom siv hluav taws xob siab.
Tau kawg, qhov zoo ntawm txoj kev ion plating uas sib xyaw ua ke evaporation thiab sputtering yog tias nws muaj zog adhesion ntawm cov yeeb yaj kiab thiab cov substrate, muaj qhov tso tawm siab, thiab tuaj yeem tsim cov yeeb yaj kiab ua tau zoo rau siv hauv cov khoom siv hluav taws xob. Metallurgical ua thiab cov khoom siv kho kom zoo nkauj kev lag luam.
