Molybdenum Semiconductor Wafers
Purity:Ntau dua lossis sib npaug li 99.95%
Loj:5-300 hli
Ceev:10.2 g / cm³
Thickness:0.1-5 hli
Nto:Polished, Ra Tsawg dua los yog sib npaug rau 0.8 μm
Melting Point:2617 degree
Kev tiv thaiv:5.2 m Ω
Txheem:ASTM B 386 Cov khoom siv
Lub sij hawm xa tuaj:25-30 HNUB
Ntawv pov thawj:ISO 9001 Daim ntawv pov thawj
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Product Details ofMolybdenum Semiconductor Wafers
Txheej txheem cej luam
Molybdenum Semiconductor Wafers yog siab -kev ua tau zoo, tshav kub- tiv taus daim hlau nyias nyias nrog txoj kab uas hla ntawm 2 ntiv mus rau 8 ntiv tes (50.8 hli txog 203.2 hli) thiab thickness ntau dua 0.05 hli. Molybdenum wafers muaj cov khoom siv hluav taws xob zoo thiab thermal conductivity, cov ntsiab lus melting siab, qis thermal expansion coefficients, tsis kam rau siab -kub creep, oxidation, thiab corrosion, thiab yog dav siv nyob rau hauv semiconductors, fais fab khoom, optoelectronics, thiab high -kub khoom. FANMETAL yog ib qho kev ntseeg siab heev uas tsis yog{11}}ferrous hlau xa khoom nrog ntau xyoo ntawm kev tsim khoom, thiab tseem tsim lwm yam khoom siv hlauxws limolybdenum barsthiab molybdenum alloys.
Yam ntxwv
Molybdenum wafers muaj cov tshuaj lom neeg ruaj khov, nrog cov ntsiab lus molybdenum txog li 99.9%, qhov ntev, thiab qhov roughness tsawg (Ra <1.6 μm). Cov yam ntxwv tseem ceeb ntawm molybdenum wafers muaj xws li:
Kub kub kuj
Lub melting point ntawm molybdenum wafers yog hais txog 2623 degree, ua rau lawv tsis tshua muaj deform los yog soften nyob rau hauv siab -kub ib puag ncig.
Tsawg coefficient ntawm thermal expansion
Lub thermal expansion coefficient ntawm molybdenum wafers yog 4.8X10-6/K, uas yog ze rau silicon (2.6-4.0X10-6/K) thiab silicon carbide (4.0X10-6/ K), zoo txo cov kev ntxhov siab thermal.
Zoo heev thermal thiab hluav taws xob conductivity
Molybdenum wafers muab cov cua kub dissipation efficiency thiab tsis tshua muaj zog, ua rau lawv zoo - haum rau siab - daim ntawv thov fais fab.
High purity, tsawg volatility
Ob peb impurities, tsawg volatilization nyob rau hauv siab -kub nqus, thiab tsis muaj txheej txheem paug.
Corrosion kuj thiab stability
Resistant rau acids, alkalis, thiab tshuaj corrosion, nrog rau lub neej ntev kev pab cuam.
High precision
Pav ca saum npoo thiab meej qhov ntev raws li precision machining yuav tsum.
daim ntawv thov
Molybdenum Wafers, nrog plaub qhov zoo tshaj plaws -siab melting point, tsawg expansion, siab thermal conductivity, thiab siab purity stability- tau dav siv nyob rau hauv cov nram qab no daim ntawv thov:
Cov khoom siv hluav taws xob semiconductor:
Tau tshaj IGBT modules thiab siab -power thyristors, Molybdenum Discs ua cov cua kub dissipation substrates thiab tiv tauj electrodes, tiv thaiv thermal stress los ntawm kub thiab txias cycling thiab tiv thaiv chip puas. Lawv tau dav siv nyob rau hauv siab - tsheb ciav hlau ceev, daim phiaj ntse, thiab kev lag luam inverters.
Thib peb - tiam semiconductors:
Molybdenum wafers ua cov cua kub dissipation substrates rau SiC thiab GaN li, muab cov thermal expansion coefficients zoo heev thiab kev ua haujlwm ruaj khov nyob rau hauv siab - fais fab xwm txheej xws li lub zog tshiab tsheb thiab 5G hauv paus chaw nres tsheb.
High-frequency RF khoom siv:
RF/microwave transistors siv nyob rau hauv satellite kev sib txuas lus thiab tub rog radar, ua hauj lwm raws li ib tug nruj grounding substrates, yog resistant rau deformation thiab xyuas kom meej meej high -frequency signal kis.
Cov txheej txheem semiconductor:
High-purity Molybdenum carrier wafers yog siv los tsim cov cab kuj disks rau CVD, PVD, siab -kub annealing, thiab lwm yam txheej txheem, muab siab flatness ntawm siab kub, tsis muaj impurity paug, thiab haum rau chip manufacturing txheej txheem.
Cov khoom siv Optoelectronic:
Molybdenum Wafers, raws li cov khoom siv hluav taws xob ua kom muaj zog rau siab - lub zog LEDs thiab laser diodes, sai sai dissipate tshav kub, tshem tawm cov chaw kub, thiab txhim kho cov cuab yeej siv tau thiab kev ua neej nyob.
Ntshiab Molybdenum vs.TZM Molybdenum AlloyWafers: Yuav Xaiv Li Cas?
Rau siab heev - laser LEDs (Laser Diodes), zoo tib yam ntshiab molybdenum tej zaum yuav tsis txaus; Hauv cov xwm txheej zoo li no, TZM Molybdenum Alloy Wafer yog qhov kev xaiv kho kom zoo dua qub. TZM yog cov khoom siv dav tshaj plaws siab-kub molybdenum alloy, muaj micro- alloys ntawm titanium, zirconium, thiab carbon. TZM muaj zog dua li cov ntshiab molybdenum, muaj peev xwm tiv taus qhov kub thiab txias tshaj 1300 degree, thiab muaj qhov zoo dua weldability thiab tag nrho lub zog.
Cov lus sib piv ntawm kab rov tav tsis muaj ntshiab molybdenum VS TZM
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Lub cev thiabcoj mus muag yam ntxwv |
Ntshiab Molybdenum Alloy Wafers |
TZM Molybdenum Alloy Wafers |
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Cov khoom xyaw tseem ceeb |
Ntau dua lossis sib npaug li 95.95% Mo |
~99.3%Mo+0.5%Ti+0.08%Zr |
|
recrystallization kub |
900℃-1000 degree |
1400 degree |
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Qhov siab tshaj plaws pom zoo kev khiav hauj lwm kub |
~ 1100 degree |
~ 1700 degree |
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Siab -kub mechanical zog |
Qhov tseem ceeb lub zog degradation thiab siab susceptibility rau warping saum 1000 degree. |
Nws yog ntau tshaj ob npaug ntawm cov ntshiab molybdenum, nrog muaj zog heev siab -kub creep kuj. |
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thermal conductivity |
138W/(m·K) |
126W/(m·K) |
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CTE |
4.8X10-6/K |
4.8X10-6/K |
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Cov khoom siv thiab cov nqi ua haujlwm |
Tus nqi pib (tus nqi siab -kev ua tau zoo piv) |
30% - ntau dua 50% siab dua (cov khoom siv raw yog kim thiab ua haujlwm nyuaj) |
Duab thiab yeeb yaj duab
Kev siv technology thiab zoo
Peb cov semiconductor-qib molybdenum discs raug nruj, ntau- txheej txheem kev tsim cov txheej txheem los xyuas kom meej cov qauv siv lead ua zoo tshaj plaws thiab kev ncaj ncees ntawm qhov chaw.
Hmoov metallurgy thiab sintering:
Ua ntej, siab -purity molybdenum hmoov yog sib xyaw ua ke thiab tsim los ntawm txias isostatic pressing (CIP), ces sintered nyob rau hauv ultra- kub lub tshuab nqus tsev tej yam kev mob los tsim ntom, siab - zoo molybdenum slabs.
Multi-dhau precision dov:
Molybdenum daim ntawv blanks yog precisely machined rau lub hom phiaj thickness los ntawm ntau yam kub thiab txias dov kis, ntxiv los ntawm kev tswj lub tshuab nqus tsev stress relief annealing thiab deg tu, uas ua rau nyias molybdenum nplooj ntawv uas tsis tshua muaj siab flatness thiab tsis muaj nyob rau hauv tsis xws luag.
Precision Shaping thiab Forming:
Advanced qeeb hlau txiav (EDM) los yog siab -precision stamping tshuab yog siv los ua cov ntawv nyias molybdenum rau hauv ib puag ncig wafers lossis wafers nrog nruj dimension thiab txoj kab uas hla tolerances, kom tsis muaj microcracks ntawm cov npoo.
Muab ob npaug rau- Daim iav Polishing:
Siv ob npaug - sab chemical mechanical polishing (CMP) thev naus laus zis los tshem tawm cov voids microscopic, ua tiav qhov ultra- tsis tshua muaj roughness (Ra<0.1 micron) ultra-low surface mirror finish on the wafer surface, significantly reducing contact thermal resistance.
Sib sib zog nqus ntxuav thiab ntim khoom:
Thaum kawg, multi-theem ultrasonic sib sib zog nqus ntxuav yog ua nyob rau hauv cov plua plav- dawb huv huv kom huv si tshem tawm cov kab mob ntawm cov kab mob, ua raws li tam sim no lub tshuab nqus tsev ntim kom paub tseeb tias xoom oxidation thiab xoom tsis xws luag ntawm lub Hoobkas.
zoo:
Nyob rau hauv cov nqe lus ntawm kev tswj kom zoo, lub Hoobkas nruj me ntsis siv GDMS purity xeem (mus txog 99.95%–99.99%), CMM micron - theem dimensional kam rau ua tswj, SEMI standard flatness pov thawj, thiab 100% ultrasonic nondestructive kuaj. Txhua qhov khoom xa tuaj tuaj nrog Daim Ntawv Pov Thawj Tshawb Xyuas Khoom (MTC) traceable rau thawj cov hmoov batch, xyuas kom cov khoom ua tau raws li cov qauv nruj "zero defect" ntawm cov semiconductor thiab lub zog tshiab lub tsheb lag luam.
FAQ
Q: Yuav ua li cas molybdenum txhim kho cov thermal tswj ntawm siab -power LED thiab IGBT chips?
A: Molybdenum coefficient ntawm thermal expansion (CTE) sib tw zoo nrog cov chips substrates, zoo alleviating thermal stress los ntawm kub thiab txias cycling thiab tiv thaiv nti cracking thiab delamination. Nyob rau tib lub sijhawm, nws muaj cov thermal conductivity zoo heev, sai sai dissipating tshav kub thiab tshem tawm cov chaw kub kub. Ua ke nrog nws qhov kub thiab txias tsis kam thiab thermal qaug zog tsis kam, nws tuav ntev - lub sij hawm thermal stability thiab comprehensively optimizes thermal tswj ntawm siab - fais fab LED thiab IGBT chips.
Q: TZM molybdenum alloy wafers puas tuaj yeem tswj qhov kub siab dua li cov ntshiab molybdenum wafers?
A: Yog lawm, TZM molybdenum alloy discs muab cov cua sov zoo dua li cov ntshiab molybdenum. Txawm hais tias ob qho tib si muaj cov ntsiab lus melting nyob ib ncig ntawm 2623 degree, cov ntshiab molybdenum undergoes recrystallisation, softening, thiab hnyav warping (creep) ntawm 900℃-1000 degree; TZM, los ntawm kev ntxiv cov kab ntawm titanium thiab zirconium carbide hais, xauv cov ciam teb, nce qhov kub ntawm recrystallisation rau 1400 degree. Qhov no tsis tsuas yog ua tiav 2-3 npaug ntawm lub zog ntawm lub zog ntawm molybdenum ntshiab tab sis kuj ua kom nws tuaj yeem nqa tau qhov hnyav thiab tuav micron- theem flatness yam tsis muaj dabtsi yog khoov txawm nyob rau hauv tsis tshua muaj siab - qhov kub thiab txias ib puag ncig mus txog 1700℃, ua rau nws yog qhov kev xaiv inevitable rau siab -kub semiconductor txheej txheem carrier.
Q: Koj puas yog cov chaw tsim khoom lossis lub tuam txhab lag luam?
A: Peb yog cov chaw tsim khoom lag luam nrog ntau xyoo kev tshaj lij, muab tag nrho cov khoom lag luam zoo -.
Q: Koj puas kam txais kev txiav txim?
A: Yog, peb txais. Peb yuav tsim thiab tsim cov khoom raws li cov lus qhia tshwj xeeb uas koj muab, thiab tseem qhia koj tias peb yuav sim peb qhov zoo tshaj plaws los daws qhov zoo tshaj plaws los muab koj cov khoom zoo tshaj -.
Q: Yuav ua li cas xaj peb cov khoom?
A: Cov neeg siv khoom tuaj yeem xa email tuaj rau peb los qhia rau peb txog lawv qhov kev txiav txim, thiab peb yuav muab cov khoom catalog. Tom qab txiav txim siab tias qee yam khoom xav tau, peb yuav rov lees paub nrog tus neeg siv khoom qhov kev txiav txim kom muaj nuj nqis, tus nqi, thiab seb qhov kev pabcuam customized ntawm cov khoom tshwj xeeb yog xav tau. Yog tias tsim nyog, cov neeg siv khoom tuaj yeem muab cov duab kos ncaj qha lossis muab tso rau lawv tus kheej cov cai. Peb yuav muab cov qauv ntawm no thiab muab tso rau hauv kev tsim khoom tom qab tau txais kev pom zoo. Lub sijhawm xa khoom yog txiav txim siab raws li qhov ntau lossis cov hnub rau kev ua haujlwm. Yog tias lub sijhawm xa khoom hloov pauv vim qee yam, peb yuav qhia rau cov neeg siv khoom ua ntej.
Q: Koj cov nqe lus them nqi yog dab tsi?
A: Them nyiaj<=1000 USD, 100% in advance. Payment>=1000 USD, 30% T / T ua ntej, tshuav nyiaj li cas ua ntej xa khoom. Yog tias koj muaj lus nug ntxiv, pls xav tiv tauj peb raws li hauv qab no.
Cim npe nrov: molybdenum semiconductor wafers, lwm tus neeg, manufacturers, hoobkas, customized, lag luam wholesale, nqe, hais, kev muag khoom
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